IBM Intel Xeon E5506 Specifikace stáhnout pdf (Strana 34)

Thermal Solutions

34 Thermal/Mechanical Design Guide

5.2 Heat Pipe Considerations

Figure 5-2 shows the orientation and position of the TTV die. The TTV die is sized and

positioned similarly to the processor die.

Figure 5-2. TTV Die Size and Orientation

Figure 1 - Side Views of Package with IHS (not to scale)

Core 1

Core 2

Core 3

Core 4

Cache Cache Cache Cache

Uncore

Core

Cache

42.5

19.3

13.2

1.0

Package CL

Die CL

NOT TO SCALE

All Dimensions in mm

1 2 ... 29 30 31 32 33 34 35 36 37 38 39 ... 97 98

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IBM Intel Xeon E5506 Specifikace Strana 34